Jalan Boon Lay data centre marks ST Engineering's fourth in SG

The company aims to complete the facility in 2026.

ST Engineering launched a data centre in Jalan Boon Lay, marking its fourth facility in Singapore.

Set for completion in 2026, the new seven-storey facility will boost ST Engineering’s IT capacity to over 30MW across four locations in Singapore, with a capex outlay of $120m over the next three years.

The data centre meets ISO 27001 for cybersecurity and ISO 42001 for responsible AI development. It can handle high-density AI and GPU workloads of over 20KW per rack.

The data centre will use various cooling systems, including the Airbitat DC Cooling System, liquid cooling, and immersion cooling to meet rack power needs.

Additionally, it will have 2,400 sq m of solar panels to reduce reliance on the grid.

These features enable ST Engineering to achieve a Power Usage Effectiveness (PUE) 1.25, well within the BCA-IMDA Green Mark Platinum threshold standard of 1.3.

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